Feasibility Study of Si Handler Debonding by Laser Release
- Bing Dang
- Thomas Wassick
- et al.
- 2016
- ECTC 2016
Conference paper
Publications
18 results for Thomas Wassick
The strength of BEOL structures fabricated using low K materials and its impact on CPI failures
- Thomas M. Shaw
- Xiao Hu Liu
- et al.
- 2015
- IIRW 2015
Conference paperElectromigration and thermal migration in Pb-free interconnects
- Minhua Lu
- Thomas Wassick
- et al.
- 2015
- ECTC 2015
Conference paperEffect of Ag and Cu content in Sn based Pb-free solder on electromigration
- Minhua Lu
- Charles Goldsmith
- et al.
- 2014
- ECTC 2014
Conference paperElectrochemical reactions in solder mask of flip chip-plastic ball grid array package
- Kang-Wook Lee
- Stephane Barbeau
- et al.
- 2013
- ECTC 2013
Conference paperComparison of electromigration behaviors of SnAg and SnCu solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- IRPS 2009
Conference paperDevelopment of a 50mm dual flip chip plastic land grid array package for server applications
- Sylvain Ouimet
- Jon Casey
- et al.
- 2008
- ECTC 2008
Conference paperExcimer laser ablation of polyimide: A 14-year IBM perspective
- James H. Brannon
- Thomas A. Wassick
- 1997
- SPIE Photonics West 1997
Conference paper