Wafer-level integration of embedded cooling approaches
- Stephan Paredes
- Yassir Madhour
- et al.
- 2014
- ISSWB 2014
Conference paper
Publications
9 results for Yassir Madhour
Modeling of two-phase evaporative heat transfer in three-dimensional multicavity high performance microprocessor chip stacks
- Yassir Madhour
- Brian P. D'Entremont
- et al.
- 2014
- ASME Journal of Electronic Packaging
PaperSTEAM: A fast compact thermal model for two-phase cooling of integrated circuits
- Arvind Sridhar
- Yassir Madhour
- et al.
- 2013
- ICCAD 2013
Conference paperIntegration of intra chip stack fluidic cooling using thin-layer solder bonding
- Yassir Madhour
- Michael Zervas
- et al.
- 2013
- 3DIC 2013
Conference paperInvestigation of novel solder patterns for power delivery and heat removal support
- Thomas Brunschwiler
- Yassir Madhour
- et al.
- 2013
- ECTC 2013
Conference paperPatterned die-to-die thin film bonding for 3D chip stacks with integrated microfluidic cooling
- Yassir Madhour
- Thomas Brunschwiler
- et al.
- 2012
- ICEPT 2012
Conference paperCooling of next generation computer chips: Parametric study for single- and two-phase cooling
- Yassir Madhour
- Severin Zimmermann
- et al.
- 2011
- THERMINIC 2011
Conference paperFlow boiling of R134a in a multi-microchannel heat sink with hotspot heaters for energy-efficient microelectronic CPU cooling applications
- Yassir Madhour
- Jonathan Olivier
- et al.
- 2011
- IEEE Transactions on CPMT
PaperTwo-phase flow boiling of R134a in a multimicrochannel heat sink for microprocessor cooling
- Yassir Madhour
- Jonathan Olivier
- et al.
- 2010
- THERMINIC 2010
Conference paper