Modeling on-board via stubs and traces in high-speed channels for achieving higher data bandwidth
- Ki Jin Han
- Xiaoxiong Gu
- et al.
- 2014
- IEEE Transactions on CPMT
Paper
Publications
8 results for Ki Jin Han
Efficient parametric modeling and analysis for backplane channel characterization
- Xiaoxiong Gu
- Ki Jin Han
- et al.
- 2012
- ECTC 2012
Conference paperImpact of multiple scattering on passivity of equivalent-circuit via models
- Xiaomin Duan
- Renato Rimolo-Donadio
- et al.
- 2011
- EDAPS 2011
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems
- Biancun Xie
- Madhavan Swaminathan
- et al.
- 2011
- EMC 2011
Conference paperParametric study on the effect of asymmetry in multi-channel differential signaling
- Ki Jin Han
- Xiaoxiong Gu
- et al.
- 2011
- EMC 2011
Conference paperRigorous electrical modeling of through silicon vias (TSVs) with MOS capacitance effects
- Tapobrata Bandyopadhyay
- Ki Jin Han
- et al.
- 2011
- IEEE Transactions on CPMT
PaperElectromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions
- Ki Jin Han
- Madhavan Swaminathan
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
PaperElectrical and physical parametric study of high-speed link performance
- Ki Jin Han
- Mark B. Ritter
- et al.
- 2010
- EPEPS 2010
Conference paper