Modeling of switching noise and coupling in multiple chips of 3D TSV-based systems
- Huanyu He
- Xiaoxiong Gu
- et al.
- 2014
- ECTC 2014
Conference paper
Publications
4 results for Huanyu He
Analysis of TSV geometric parameter impact on switching noise in 3D power distribution network
- Huanyu He
- James J.-Q. Lu
- et al.
- 2014
- ASMC 2014
Conference paperPower delivery modeling for 3D systems with non-uniform TSV distribution
- Huanyu He
- Zheng Xu
- et al.
- 2013
- ECTC 2013
Conference paperTSV density impact on 3D power delivery with high aspect ratio TSVs
- Huanyu He
- James J.-Q. Lu
- et al.
- 2013
- ASMC 2013
Conference paper