Resistivity of copper interconnects beyond the 7 nm node
- Adam Pyzyna
- Robert L. Bruce
- et al.
- 2015
- VLSI Technology 2015
Conference paper
Publications
45 results for Hiroyuki Miyazoe
Defect mitigation of plasma-induced delamination of TiW/Cu from SiNx layer in thin si interposer processing with glass carriers
- Vijay Sukumaran
- Thuy Tran-Quinn
- et al.
- 2015
- ECTC 2015
Conference paperPathway to the Piezoelectronic Transduction Logic Device
- Paul Solomon
- Brian A. Bryce
- et al.
- 2015
- Nano Letters
PaperSelf-aligned line-space pattern customization with directed self-assembly graphoepitaxy at 24nm pitch
- Hsinyu Tsai
- Hiroyuki Miyazoe
- et al.
- 2015
- SPIE Advanced Lithography 2015
Conference paperElectrical characterization of FinFETs with fins formed by directed self assembly at 29 nm fin pitch using a self-aligned fin customization scheme
- Hsinyu Tsai
- Hiroyuki Miyazoe
- et al.
- 2014
- IEDM 2014
Conference paperTwo-dimensional pattern formation using graphoepitaxy of PS-b-PMMA block copolymers for advanced FinFET device and circuit fabrication
- Hsinyu Tsai
- Jed W. Pitera
- et al.
- 2014
- ACS Nano
PaperThe PiezoElectronic switch: A path to low energy electronics
- Paul Solomon
- Brian A. Bryce
- et al.
- 2013
- E3S 2013
Conference paperPattern transfer of directed self-assembly (DSA) patterns for CMOS device applications
- Hsin-Yu Tsai
- Hiroyuki Miyazoe
- et al.
- 2013
- SPIE Advanced Lithography 2013
Conference paperAdvanced plasma etch for the 10nm node and beyond
- 2013
- SPIE Advanced Lithography 2013
Conference paperCarbon nanotube complementary wrap-gate transistors
- Aaron D. Franklin
- Siyuranga O. Koswatta
- et al.
- 2013
- Nano Letters
Paper