Publications

2 results for Wei Lin

Bonding technologies for chip level and wafer level 3D integration
- - Katsuyuki Sakuma
  - Spyridon Skordas
  - et al.
- 2014
- ECTC 2014
Conference paper
Copper-to-dielectric heterogeneous bonding for 3D integration
- - Wei Lin
  - Juntao Li
  - et al.
- 2014
- LTB-3D 2014
Conference paper