Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- Benjamin D. Briggs
- C.B. Pcethala
- et al.
- 2018
- IITC 2018
Conference paper
Publications
71 results for Griselda Bonilla
Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study
- Nicholas A. Lanzillo
- Oscar D. Restrepo
- et al.
- 2018
- Applied Physics Letters
PaperFundamental limitations of existing models and future solutions for dielectric reliability and RRAM applications (invited)
- Ernest Y. Wu
- Andrew Kim
- et al.
- 2017
- IEDM 2017
Conference paperFully aligned via integration for extendibility of interconnects to beyond the 7 nm node
- Benjamin D. Briggs
- C.B. Peethala
- et al.
- 2017
- IEDM 2017
Conference paperLine Resistance Reduction in Advanced Copper Interconnects
- Chih-Chao Yang
- T. Standaert
- et al.
- 2017
- IEEE Electron Device Letters
PaperTri-layer nanoindentation for mechanical characterization of ultra-low-k dielectrics
- Tingge Xu
- Yingjie Du
- et al.
- 2017
- IITC 2017
Conference paperReliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
- C. J. Penny
- S. Gates
- et al.
- 2017
- IITC 2017
Conference paperMethods to lower the resistivity of ruthenium interconnects at 7 nm node and beyond
- Xunyuan Zhang
- Huai Huang
- et al.
- 2017
- IITC 2017
Conference paperA new and holistic modelling approach for impact of line-edge roughness on dielectric reliability
- Ernest Y. Wu
- Ramachandran Muralidhar
- et al.
- 2017
- IRPS 2017
Conference paperA stochastic model for impact of LER on BEOL TDDB
- Ramachandran Muralidhar
- Ernest Y. Wu
- et al.
- 2017
- IRPS 2017
Conference paper