Scaling effect on electromigration in on-chip Cu wiring
- C.-K. Hu
- R. Rosenberg
- et al.
- 1999
- IITC 1999
Conference paper
Publications
149 results for C. K. Hu
Electromigration path in Cu thin-film lines
- C.-K. Hu
- R. Rosenberg
- et al.
- 1999
- Applied Physics Letters
PaperIn-situ x-ray microbeam Cu fluorescence and strain measurements on Al(0.5 at.% Cu) conductor lines during electromigration
- H.K. Kao
- G.S. Cargill III
- et al.
- 1999
- Materials Research Society Symposium - Proceedings
Conference paperMechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperMechanisms for microstructure evolution in electroplated copper thin films near room temperature
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
PaperElectromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction
- P.-C. Wang
- G.S. Cargill
- et al.
- 1998
- Applied Physics Letters
PaperReliability and copper interconnections with low dielectric constant materials
- C.-K. Hu
- 1998
- MRS Spring Meeting 1998
Conference paperExtendibility of Cu damascene to 0.1 μm wide interconnections
- C.-K. Hu
- K.Y. Lee
- et al.
- 1998
- MRS Spring Meeting 1998
Conference paperMechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperCopper interconnections and reliability
- C.-K. Hu
- J.M.E. Harper
- 1998
- Materials Chemistry and Physics
Review