Electromigration in 0.25 μm wide Cu line on W
- C.-K. Hu
- K.Y. Lee
- et al.
- 1997
- Thin Solid Films
Paper
Publications
149 results for C. K. Hu
Copper interconnect: Fabrication and reliability
- C.-K. Hu
- J.M.E. Harper
- 1997
- VLSI-TSA 1997
Conference paperElectromigration failures in line-stud structures as a function of line length
- M.B. Small
- C.-K. Hu
- 1997
- Thin Solid Films
PaperGrain boundary diffusion and electromigration in Cu-Sn alloy thin films and their VLSI interconnects
- D. Gupta
- C.-K. Hu
- et al.
- 1997
- Defect and Diffusion Forum
PaperEffect of copper on the microstructure and electromigration lifetime of Ti-AlCu-Ti fine lines in the presence of tungsten diffusion barriers
- A. Domenicucci
- R. Filippi
- et al.
- 1996
- Journal of Applied Physics
PaperElectromigration and diffusion in pure Cu and Cu(Sn) alloys
- C.-K. Hu
- K.L. Lee
- et al.
- 1996
- MRS Spring Meeting 1996
Conference paperElectromigration and diffusion in pure Cu and Cu(Sn) alloys
- C.-K. Hu
- K.L. Lee
- et al.
- 1996
- MRS Spring Meeting 1996
Conference paperLocal and global stress distributions in BEOL metallization
- I.C. Noyan
- E. Liniger
- et al.
- 1996
- MRS Spring Meeting 1996
Conference paperCopper migration and precipitate dissolution in aluminum/copper lines during electromigration testing
- T.M. Shaw
- C.-K. Hu
- et al.
- 1996
- MRS Spring Meeting 1996
Conference paperElectromigration drift velocity in Al-alloy and Cu-alloy lines
- C.-K. Hu
- K.Y. Lee
- et al.
- 1996
- JES
Paper