Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- S. Nguyen
- H. Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Conference paper
Publications
8 results for A. Dutta
Development of Epitaxial SiGeB as a Test Vehicle to Evaluate Source-Drain Etchout during Channel Release of Gate-all-Around Devices: Topic/category: AEPM: Advanced Equipment Processes and Materials
- M. Nasseri
- C. Durfee
- et al.
- 2024
- ASMC 2024
Conference paperFirst Experimental Demonstration of MRAM Data Scrubbing: 80 Mb MRAM with 40 nm junctions for Last Level Cache Applications
- H. Wu
- V. Katragadda
- et al.
- 2021
- IEDM 2021
Conference paperA 14 nm embedded STT-MRAM CMOS technology
- Daniel C. Edelstein
- M. Rizzolo
- et al.
- 2020
- IEDM 2020
Conference paperStrategies for aggressive scaling of EUV multi-patterning to sub-20 nm features
- A. Dutta
- Jennifer Church
- et al.
- 2020
- SPIE Advanced Lithography 2020
Conference paperPatterning material challenges for improving euv stochastics
- Anuja De Silva
- Luciana Meli
- et al.
- 2019
- J. Photopolym. Sci. Tech.
PaperInorganic hardmask development for extreme ultraviolet patterning
- Anuja De Silva
- A. Dutta
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
PaperInorganic hardmask development for EUV patterning
- Anuja De Silva
- A. Dutta
- et al.
- 2018
- SPIE Advanced Lithography 2018
Conference paper