Adhesion durability of tantalum BPDA-PDA polyimide interfaces
- D. Neuaroschl
- B.K. Furman
- et al.
- 1994
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Paper
Publications
62 results for S. Purushothaman
Thin film transfer process for low cost MCM's
- C. Narayan
- S. Purushothaman
- 1993
- IEMT 1993
Conference paperTa/polyimide adhesion durability
- A.C. Callegari
- B.K. Furman
- et al.
- 1992
- ESSDERC 1992
Conference paperMoisture-induced interfacial oxidation of chromium on polyimide
- B.K. Furman
- H.M. Clearfield
- et al.
- 1992
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Conference paperReaction of water with ion beam modified metal/polyimide thin films
- B.K. Furman
- H.M. Clearfield
- et al.
- 1991
- International Conference on Polyimides 1991
Conference paperPROCESSING CONCERNS FOR MULTI-LEVEL THIN FILM METALLIZATION.
- C. Narayan
- J.E. Lewis
- et al.
- 1986
- ECS Meeting 1986
Conference paperCryogenic temperature mechanical behavior of solid mercury
- S. Purushothaman
- T. Caulfield
- 1984
- Journal of Applied Physics
PaperAGING RESPONSE AND CRYOGENIC MECHANICAL PROPERTIES OF AN In-Sn EUTECTIC SOLDER ALLOY FOR JOSEPHSON PACKAGING.
- T. Caulfield
- S. Purushothaman
- et al.
- 1983
- International Cryogenic Materials Conference 1983
Conference paperGeometrical effects in contact resistance measurements: Finite element modeling and experimental results
- M. Natan
- S. Purushothaman
- et al.
- 1982
- Journal of Applied Physics
PaperPackaging Technology for Josephson Integrated Circuits
- Syamal K. Lahiri
- H. Randall Bickford
- et al.
- 1982
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Paper