Lower-k SiCOH integration for 65 nm ground rules
- T. Nogami
- S. Lane
- et al.
- 2005
- VMIC 2005
Conference paper
Publications
48 results for E. Simonyi
Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes
- T. Nogami
- S. Lane
- et al.
- 2005
- Optics East 2005
Conference paperMechanical and dielectric characterization of low-k, porous organosilicates
- Willi Volksen
- Teddie P. Magbitang
- et al.
- 2005
- VMIC 2005
Conference paperApplication of nanoindentation to characterize fracture in ILD films used in the BEOL
- Eva E. Simonyi
- E. Liniger
- et al.
- 2005
- MRS Spring Meeting 2005
Conference paperReliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
- D. Edelstein
- C.R. Davis
- et al.
- 2004
- IITC 2004
Conference paperOptimization of SiCOH dielectrics for integration in a 90 nm CMOS technology
- A. Grill
- D. Edelstein
- et al.
- 2004
- IITC 2004
Conference paperMoisture-driven crack growth in blanket low dielectric constant and ultralow dielectric constant films
- E. Liniger
- E. Simonyi
- 2004
- Journal of Applied Physics
PaperComprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Conference paperA buckling-based metrology for measuring the elastic moduli of polymeric thin films
- Christopher M. Stafford
- Christopher Harrison
- et al.
- 2004
- Nature Materials
PaperComprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Conference paper