Analysis of an extreme low-κ organosilicate dielectric film exposed to representative plasmas and to a restorative process
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Processing dependent thermal conductivity of nanoporous silica xerogel films
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PaperEffects of processing history on the modulus of silica xerogel films
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PaperOpportunities and challenges in ultra low k dielectrics for interconnect applications
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- Technical Digest-International Electron Devices Meeting
PaperPorous silica materials as low-k dielectrics for electronic and optical interconnects
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- Thin Solid Films
PaperProperties development during curing of low dielectric-constant spin-on glasses
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- MRS Spring Meeting 1998
Conference paperCharacterization of spin -on glasses by microindentation
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Conference paperTa and TaN adhesion to high-temperature fluorinated polyimides. Surface and interface chemistry
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- Journal of Adhesion Science and Technology
PaperPolymeric organic-inorganic hybrid nanocomposites: Preparation of polyimide-modified poly(silsesquioxane) using functionalized poly(amic acid alkyl ester) precursors
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- Macromolecules
PaperNanoscopically engineered organic-inorganic hybrids as low dielectric constant, high modulus insulating materials for microelectronic applications
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- American Chemical Society, Polymer Preprints, Division of Polymer Chemistry
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