Minimum void size and 3-parameter lognormal distribution for em failures in Cu interconnects
- Baozhen Li
- Cathryn Christiansen
- et al.
- 2006
- IRPS 2006
Conference paper
Publications
60 results for Baozhen Li
BEOL process integration with Cu/SiCOH (k=2.8) low-k interconnects at 65nm groundrules
- S. Lane
- M. Fukasawa
- et al.
- 2005
- AMC 2005
Conference paperA SiCOH BEOL interconnect technology for high density and high performance 65 nm CMOS applications
- Matthew Angyal
- Jason Gill
- et al.
- 2005
- AMC 2005
Conference paperDetermination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures
- F. Chen
- J. Gill
- et al.
- 2006
- Microelectronics Reliability
PaperBEOL process integration with Cu/SiCOH (k=2.8) low-k interconnects at 65 nm groundrules
- M. Fukasawa
- S. Lane
- et al.
- 2005
- IITC 2005
Conference paperLower-k SiCOH integration for 65 nm ground rules
- T. Nogami
- S. Lane
- et al.
- 2005
- VMIC 2005
Conference paperLow-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes
- T. Nogami
- S. Lane
- et al.
- 2005
- Optics East 2005
Conference paperMeasurements of effective thermal conductivity for advanced interconnect structures with various composite low-K dielectrics
- F. Chen
- J. Gill
- et al.
- 2004
- IRPS 2004
Conference paperMeasurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics
- F. Chen
- J. Gill
- et al.
- 2004
- IRPS 2004
Conference paperA 90nm dual damascene hybrid (organic / inorganic) low-k - Copper BEOL integration scheme
- T. Dalton
- A. Cowley
- et al.
- 2003
- ADMETA 2003
Conference paper