Determination of transmission line parameters in time- and frequency domain for product related packaging structures
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2007
- IEEE-SPI 2007
Conference paper
Publications
184 results for Christian Baks
160-Gb/s bidirectional parallel optical transceiver module for board-level interconnects using a single-chip CMOS IC
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2007
- ECTC 2007
Conference paper160-Gb/s, 16-channel full-duplex, single-chip CMOS optical transceiver
- C.L. Schow
- F.E. Doany
- et al.
- 2007
- OFC 2007
Conference paperOptical high speed symmetric multi-processor link implementation
- Daniel Kuchta
- Christian Baks
- et al.
- 2006
- ECTC 2006
Conference paperDesign, analysis and experimental verification of an equalized 10Gbps link
- Lei Shan
- Young Kwark
- et al.
- 2006
- DesignCon 2006
Conference paperTerabus: Terabit/second-class card-level optical interconnect technologies
- Laurent Schares
- Jeffrey A. Kash
- et al.
- 2006
- IEEE Journal on Selected Topics in Quantum Electronics
PaperSilicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ADMETA 2005
Conference paperChip-to-chip optical interconnects
- J.A. Kash
- F.E. Doany
- et al.
- 2006
- OFC/NFOEC 2006
Conference paperDetermination of the complex permittivity of packaging materials at millimeter-wave frequencies
- Thomas Zwick
- Arun Chandrasekhar
- et al.
- 2006
- IEEE T-MTT
PaperComparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Conference paper