Power delivery modeling for 3D systems with non-uniform TSV distribution
- Huanyu He
- Zheng Xu
- et al.
- 2013
- ECTC 2013
Conference paper
Publications
6 results for Zheng Xu
TSV density impact on 3D power delivery with high aspect ratio TSVs
- Huanyu He
- James J.-Q. Lu
- et al.
- 2013
- ASMC 2013
Conference paperMultiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
Conference paperCu-based bonding technology for 3D integration applications
- K.N. Chen
- Zheng Xu
- et al.
- 2012
- 3DIC 2012
Conference paperElectromagnetic-SPICE modeling and analysis of 3D power network
- Zheng Xu
- Jian-Qiang Lu
- et al.
- 2011
- ECTC 2011
Conference paperParasitics extraction, wideband modeling and sensitivity analysis of through-strata-via (TSV) in 3D integration/packaging
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2011
- ASMC 2011
Conference paper