Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals
- Takeshi Nogami
- C. Penny
- et al.
- 2012
- IEDM 2012
Conference paper
Publications
7 results for S. Chiang
Impact of direct plasma densification on resistivity and conformality of PEALD tantalum nitride
- O. Van Der Straten
- Xunyuan Zhang
- et al.
- 2012
- PRiME/ECS Meeting 2012
Conference paperCVD Co and its application to Cu damascene interconnections
- Takeshi Nogami
- J. Maniscalco
- et al.
- 2010
- IITC 2010
Conference paperIonized-PVD stacked barrier structure of TaN/TaRu for 32nm BEOL integration
- Takeshi Nogami
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008
Conference paperRobust and low cost copper contact application for low power device at 32 nm-node and beyond
- Atsunobu Isobayashi
- James J. Kelly
- et al.
- 2009
- IITC 2009
Conference paperPEALD Ru liner conformality and Cu trench fill characteristics
- O. Van Der Straten
- J. Wynne
- et al.
- 2008
- ECS Meeting 2008
Conference paperMorphology of electrodeposited Cu on 300 mm PEALD Ru substrates
- J. Kelly
- T. Vo
- et al.
- 2008
- ECS Meeting 2008
Conference paper