Experimental analysis and modeling of self heating effect in dielectric isolated planar and fin devices
- S. Lee
- Richard A. Wachnik
- et al.
- 2013
- VLSI Technology 2013
Conference paper
Publications
8 results for J. Johnson
22nm High-performance SOI technology featuring dual-embedded stressors, Epi-Plate High-K deep-trench embedded DRAM and self-aligned Via 15LM BEOL
- S. Narasimha
- P. Chang
- et al.
- 2012
- IEDM 2012
Conference paperAdvanced modeling and optimization of high performance 32nm HKMG SOI CMOS for RF/analog SoC applications
- Sungjae Lee
- J. Johnson
- et al.
- 2012
- VLSI Technology 2012
Conference paperA Simple, unified 3D stress model for device design in stress-enhanced mobility technologies
- Arvind Kumar
- Kai Xiu
- et al.
- 2012
- SISPAD 2012
Conference paperHole transport in nanoscale p-type MOSFET SOI devices with high strain
- H. Nayfeh
- S.-J. Jeng
- et al.
- 2007
- DRC 2007
Conference paperSOI CMOS technology with 360GHz fT NFET, 260GHz fT PFET, and record circuit performance for millimeter-wave digital and analog system-on-chip applications
- Sungjae Lee
- Jonghae Kim
- et al.
- 2007
- VLSI Technology 2007
Conference paperImproving the power-performance of multicore processors through optimization of lithography and thermal processing
- A. Gabor
- T.A. Brunner
- et al.
- 2007
- SPIE Advanced Lithography 2007
Conference paperHigh performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
- S. Narasimha
- K. Onishi
- et al.
- 2006
- IEDM 2006
Conference paper