Low temperature Au-Au flip chip bonding with VUV/O 3 treatment for 3D integration
- Akiko Okada
- Masatsugu Nimura
- et al.
- 2012
- LTB-3D 2012
Conference paper
Publications
5 results for Naoko Unami
Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment
- Naoko Unami
- Hirokazu Noma
- et al.
- 2011
- APM 2011
Conference paperFluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- Katsuyuki Sakuma
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Conference paperEffects of vacuum ultraviolet surface treatment on the bonding interconnections for flip chip and 3-D integration
- Katsuyuki Sakuma
- Jun Mizuno
- et al.
- 2010
- IEEE Transactions on Electronics Packaging Manufacturing
PaperEffects of excimer irradiation treatment on thermocompression Au-Au bonding
- Naoko Unami
- Katsuyuki Sakuma
- et al.
- 2010
- Japanese Journal of Applied Physics
Paper