EUV OPC for 56 nm metal pitchMartin BurkhardtMatt Colburnet al.2011SPIE Advanced Lithography 2011Conference paper
Overcoming the challenges of 22-nm node patterning through litho-design co-optimizationMartin BurkhardeJ.C. Arnoldet al.2009SPIE Advanced Lithography 2009Conference paper
32 NM Logic patterning options with immersion lithographyK. LaiS. Burnset al.2008SPIE Advanced Lithography 2008Conference paper