Publications

2 results for Gözde Töral

Pin-shape assessment for interlayer-cooled chip stacks with periodic boundary condition modeling
- - Gözde Töral
  - Roland Bender
  - et al.
- 2010
- THERMINIC 2010
Conference paper
Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks
- - T. Brunschwiler
  - S. Paredes
  - et al.
- 2009
- 3DIC 2009
Conference paper