Integrated microfluidic cooling and interconnects for 2D and 3D chips
- Bing Dang
- Muhannad S. Bakir
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
Paper
Publications
3 results for Calvin R. King Jr.
3D stacking of chips with electrical and microfluidic I/O interconnects
- Calvin R. King Jr.
- Deepak Sekar
- et al.
- 2008
- ECTC 2008
Conference paperA 3D-IC technology with integrated microchannel cooling
- Deepak Sekar
- Calvin King
- et al.
- 2008
- IITC 2008
Conference paper