Novel, High-Throughput, Fiber-to-Chip Assembly Employing only Off-the-Shelf Components
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2017
- ECTC 2017
Conference paper
Publications
102 results for Tymon Barwicz
High-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2017
- OFC 2017
Conference paperA polymer waveguide material optimized for on-board optical links and Si photonic interfaces
- Shotaro Takenobu
- Kenta Kobayashi
- et al.
- 2017
- OFC 2017
Conference paperA silicon metamaterial chip-to-chip coupler for photonic flip-chip applications
- Tymon Barwicz
- Swetha Kamlapurkar
- et al.
- 2017
- OFC 2017
Conference paperMetamaterial waveguides with low distributed backscattering in production O-band Si photonics
- Bo Peng
- Chi Xiong
- et al.
- 2017
- OFC 2017
Conference paperSilicon photonics and challenges for fabrication
- N. Feilchenfeld
- Karen Nummy
- et al.
- 2017
- SPIE Advanced Lithography 2017
Conference paperReducing line edge roughness in si and sin through plasma etch chemistry optimization for photonic waveguide applications
- Nathan Marchack
- Marwan Khater
- et al.
- 2017
- SPIE Advanced Lithography 2017
Conference paperDistributed backscattering due to stochastic defects in production O-band Si photonic waveguides
- Bo Peng
- Jessie C. Rosenberg
- et al.
- 2016
- CLEO 2016
Conference paperA novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2016
- IEEE JSTQE
PaperSilicon photonics for on-chip trace-gas spectroscopy
- 2016
- NANOCOM 2016
Conference paper