Transport in refractory metals and their interaction with SiO2: Comparison of tungsten and molybdenumL. Krusin-ElbaumM.O. Aboelfotohet al.1987Thin Solid FilmsPaper
A comparison of tungsten film deposition techniques for very large scale integration technologyK.Y. Ahn1987Thin Solid FilmsPaper
Effects of substrate temperature on copper distribution, resistivity, and microstructure in magnetron-sputtered Al-Cu filmsK.Y. AhnT. Linet al.1987Thin Solid FilmsPaper
Properties of reactively sputtered tungsten films in nitrogen and oxygenK.Y. AhnS.B. Brodskvet al.1986JVSTAPaper
Effects of deposition methods on the temperature-dependent resistivity of tunasten filmsL. Krusin-ElbaumK.Y. Ahnet al.1986JVSTAPaper
Effects of biased cosputtering on resistivity and step coverage in tungsten silicide filmsK.W. ChoiK.Y. Ahn1985JVSTAPaper
Stress modification of WSi2.2 films by concurrent low energy ion bombardment during alloy evaporationD.S. YeeJ. Floroet al.1985JVSTAPaper
Formation of TiSi2 and TiN during nitrogen annealing of magnetron sputtered Ti filmsE.D. AdamsK.Y. Ahnet al.1985JVSTAPaper
A critical comparison of silicide film deposition techniquesK.Y. AhnS. Basavaiah1984Thin Solid FilmsPaper