Effects of additive elements on the phase formation and morphological stability of nickel monosilicide films
- C. Lavoie
- C. Detavernier
- et al.
- 2006
- Microelectronic Engineering
Paper
Publications
159 results for F.M. D'Heurle
Reactive diffusion in the Ni-Si system: Influence of Ni thickness on the phase formation sequence
- C. Coïa
- C. Lavoie
- et al.
- 2005
- ECS Meeting 2005
Conference paperStress development during the reactive formation of silicide films
- Olivier Thomas
- Patrice Gergaud
- et al.
- 2004
- DIMAT 2004
Conference paperReactive diffusion in the Ni-Si system: Phase sequence and formation of metal-rich phases
- C. Lavoie
- C. Coia
- et al.
- 2004
- DIMAT 2004
Conference paperCoherent superconducting behavior of two metals (Al-Pb) in a synthetic filamentary structure
- D.P. Seraphim
- F.M. D'Heurle
- et al.
- 2004
- Applied Physics Letters
PaperMetastable alloys of CuCo and CuAg thin films deposited in vacuum
- S. Mader
- H. Widmer
- et al.
- 2004
- Applied Physics Letters
PaperLow-temperature formation of CoSi 2 in the presence of Au
- C. Detavernier
- C. Lavoie
- et al.
- 2004
- Journal of Applied Physics
PaperFormation of embedded Co nanoparticles by reaction in Al/Co multilayers and impact on phase sequence
- P. Gas
- C. Bergman
- et al.
- 2004
- Applied Physics Letters
PaperDiffusion in intermetallic compounds: The ordered Cu3Au rule, its history
- François M. D'Heurle
- Patrick Gas
- et al.
- 2004
- Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques
ReviewTowards implementation of a nickel silicide process for CMOS technologies
- C. Lavoie
- F.M. D'Heurle
- et al.
- 2003
- Microelectronic Engineering
Conference paper