A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2016
- IEEE JSTQE
Paper
Publications
67 results for Yoichi Taira
Sub-Micron Bondline-Shape Control in Automated Assembly of Photonic Devices
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2016
- ECTC 2016
Conference paperLow loss polymer waveguide components for silicon photonic packaging
- Hidetoshi Numata
- Yoichi Taira
- et al.
- 2015
- ICSJ 2015
Conference paperEnabling large-scale deployment of photonics through cost-efficient and scalable packaging
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- GFP 2015
Conference paperImproved connectorization of compliant polymer waveguide ribbon for silicon nanophotonics chip interfacing to optical fibers
- Yoichi Taira
- Hidetoshi Numata
- et al.
- 2015
- ECTC 2015
Conference paperFlexible polymer optical waveguide for Si photonics interface
- Shotaro Takenobu
- Toshihisa Okada
- et al.
- 2015
- OFC 2015
Conference paperPhotonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- OFC 2015
Conference paperOptical demonstration of a compliant polymer interface between standard fibers and nanophotonic waveguides
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- OFC 2015
Conference paperNanofiller based spin-on materials for negligible reflection of silicon photonic external coupling
- Yoichi Taira
- Ryuma Mizusawa
- et al.
- 2014
- ECTC 2014
Conference paperAssembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2014
- ECTC 2014
Conference paper