Cu and dilute binary Cu(Ti), Cu(Sn) and Cu(Al) thin films: Texture, grain growth and resistivity
- A. Gungor
- K. Barmak
- et al.
- 2002
- MRS Proceedings 2002
Conference paper
Publications
122 results for J.M.E. Harper
Texture and resistivity of Cu and dilute Cu alloy films
- K. Barmak
- A. Gungor
- et al.
- 2002
- MRS Proceedings 2002
Conference paperPicosecond ultrasonics study of the vibrational modes of a nanostructure
- G. Andrew Antonelli
- Humphrey J. Maris
- et al.
- 2002
- Journal of Applied Physics
PaperEffects of alloying elements on cobalt silicide formation
- C. Lavoie
- C. Cabral Jr.
- et al.
- 2002
- Journal of Electronic Materials
PaperIn situ resistivity study of copper-cobalt films: Precipitation, dissolution and phase transformation
- S.-L. Zhang
- J.M.E. Harper
- et al.
- 2001
- Thin Solid Films
PaperFormation of c54 tisi2: Effects of niobium additions on the apparent activation energy
- F.M. D’Heurle
- S.-L. Zhang
- et al.
- 2001
- Journal of Applied Physics
PaperThe use of in situ X-ray diffraction, optical scattering and resistance analysis techniques for evaluation of copper diffusion barriers in blanket films and damascene structures
- C. Cabral Jr.
- C. Lavoie
- et al.
- 2001
- Thin Solid Films
PaperTwo-step codeposition process for enhanced C54-TiSi2 formation in the Ti-Si binary system
- A. Quintero
- M. Libera
- et al.
- 2001
- Journal of Applied Physics
PaperHigh conductivity copper-boron alloys obtained by low temperature annealing
- S.-L. Zhang
- J.M.E. Harper
- et al.
- 2001
- Journal of Electronic Materials
PaperExploring thin-film reactions by means of simultaneous x-ray surface roughness and resistance measurements
- C. Lavoie
- C. Cabral Jr.
- et al.
- 2001
- Defect and Diffusion Forum
Paper