Determination of partial currents for cuni and cuco electrodeposition using rotating ring-disk electrodes
- Jean Horkans
- I-Chia Hsu Chang
- et al.
- 2019
- JES
Paper
Publications
28 results for Jean Horkans
A TEM Study of the Effect of Accelerators on Pd-Sn Colloidal Catalysts and on the Initiation of Electroless Cu Deposition on Epoxy
- Jean Horkans
- Jungihl Kim
- et al.
- 2019
- JES
PaperComparison of the Activity of PdSn Colloidal Catalysts with the Activity of Pure Metals for HCHO Oxidation: Enhancement of the Activity by Ionic Tin
- Jean Horkans
- 2019
- JES
PaperA Cyclic Voltammetric Study of Pd-Sn Colloidal Catalysts for Electroless Deposition
- Jean Horkans
- 2019
- JES
PaperPb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999
Conference paperPolarographic methods of monitoring addition agents in the electroplating of Sn-Pb solders
- J. Horkans
- 1998
- IBM J. Res. Dev
PaperDamascene copper electroplating for chip interconnections
- P.C. Andricacos
- C. Uzoh
- et al.
- 1998
- IBM J. Res. Dev
PaperElectrodeposition for Hi-MEMS with special reference to fabrication of a magnetic mini-motor
- E.J.M. O'Sullivan
- E.I. Cooper
- et al.
- 1996
- MRS Fall Meeting 1996
Conference paperElectrochemical Fabrication of Mechanically Robust PbSn C4 Interconnections
- J. Roeder
- H. Deligianni
- et al.
- 1995
- JES
PaperAlloying of a Less Noble Metal in Electrodeposited Cu Through Underpotential Deposition
- Hariklia Deligianni
- I-Chia Hsu Chang
- et al.
- 1995
- JES
Paper