Mixing, rheology, and stability of highly filled thermal pastes
- Claudius Feger
- Jeffrey D. Gelorme
- et al.
- 2005
- IBM J. Res. Dev
Paper
Publications
26925 results for Science
Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects
- Edward J. Yarmchuk
- Christopher W. Cline
- et al.
- 2005
- IBM J. Res. Dev
PaperThe enterprise service bus: Making service-oriented architecture real
- Marc-Thomas Schmidt
- Beth Hutchison
- et al.
- 2005
- IBM Systems Journal
PaperExploitation of optical interconnects in future server architectures
- Alan F. Benner
- Michael Ignatowski
- et al.
- 2005
- IBM J. Res. Dev
ReviewLow-cost wafer bumping
- Peter A. Gruber
- Luc Bélanger
- et al.
- 2005
- IBM J. Res. Dev
ReviewBladeCenter solutions
- Lynn S. Fore
- David W. Cosby
- et al.
- 2005
- IBM J. Res. Dev
ReviewMicrominiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements
- Mary Yvonne Lanzerotti
- Giovanni Fiorenza
- et al.
- 2005
- IBM J. Res. Dev
ReviewEnergy harvesting and conservation
- Roy Want
- Keith I. Farkas
- et al.
- 2005
- IEEE Pervasive Computing
ReviewExperience with K42, an open-source, Linux-compatible, scalable operating-system kernel
- Jonathan Appavoo
- Marc Auslander
- et al.
- 2005
- IBM Systems Journal
ReviewRecent developments in high-moment electroplated materials for recording heads
- Emanuel I. Cooper
- Christian Bonhôte
- et al.
- 2005
- IBM J. Res. Dev
Review