Modeling of two-phase evaporative heat transfer in three-dimensional multicavity high performance microprocessor chip stacks
- Yassir Madhour
- Brian P. D'Entremont
- et al.
- 2014
- ASME Journal of Electronic Packaging
Publications
9291 results for Computer Science
Temperature-dependent studies of the electrical properties and the conduction mechanism of HfOx-based RRAM
- Chiyui Ahn
- Seyoung Kim
- et al.
- 2014
- VLSI-TSA 2014
The resilience wall: Cross-layer solution strategies
- Subhasish Mitra
- Pradip Bose
- et al.
- 2014
- VLSI-TSA 2014
TideWatch: Fingerprinting the cyclicality of big data workloads
- Dan Williams
- Shuai Zheng
- et al.
- 2014
- INFOCOM 2014
Practical DCB for improved data center networks
- Brent Stephens
- Alan L. Cox
- et al.
- 2014
- INFOCOM 2014
Distributed backup scheduling: Modeling and optimization
- Peter M. Van De Ven
- Bo Zhang
- et al.
- 2014
- INFOCOM 2014
Monitor placement for maximal identifiability in network tomography
- Liang Ma
- Ting He
- et al.
- 2014
- INFOCOM 2014
On the effect of forwarding table size on SDN network utilization
- Rami Cohen
- Liane Lewin-Eytan
- et al.
- 2014
- INFOCOM 2014
Cross-layer path management in multi-path transport protocol for mobile devices
- Yeon-Sup Lim
- Yung-Chih Chen
- et al.
- 2014
- INFOCOM 2014
Coverage in visual sensor networks with Pan-Tilt-Zoom cameras: The MaxFoV problem
- Vikram P. Munishwar
- Vinay Kolar
- et al.
- 2014
- INFOCOM 2014