Characterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
Publications
3549 results for Materials Discovery
Nitrogen implantation and diffusion in silicon
- Lahir Shaik Adam
- Mark E. Law
- et al.
- 1999
- MRS Spring Meeting 1999
Low dielectric constant SiCOH films as potential candidates for interconnect dielectrics
- A. Grill
- L. Perraud
- et al.
- 1999
- MRS Spring Meeting 1999
Transient enhanced diffusion and dose loss of indium in silicon
- Omer Dokumaci
- Paul Ronsheim
- et al.
- 1999
- MRS Spring Meeting 1999
Sub-30 nm abrupt P+ junction formation with Ge preamorphization and high energy Si co-implantation
- K.L. Lee
- Ted Zabel
- et al.
- 1999
- MRS Spring Meeting 1999
Characterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
Characterization of plated Cu thin film microstructures
- L. Gignac
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Classification of the modes of dissociation in immiscible Cu-alloy thin films
- K. Barmak
- G.A. Lucadamo
- et al.
- 1999
- MRS Spring Meeting 1999
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
In-situ study of Ti/TiN stability under nitrogen anneal
- P. DeHaven
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999