PVD Cu reflow seed process optimization for defect reduction in nanoscale Cu/Low-k dual damascene interconnects
- K. Motoyama
- O. Van Der Straten
- et al.
- 2013
- JES
Paper
Publications
14465 results for Physical Sciences
Antimicrobial polycarbonates: Investigating the impact of balancing charge and hydrophobicity using a same-centered polymer approach
- Amanda C. Engler
- Jeremy P. K. Tan
- et al.
- 2013
- Biomacromolecules
PaperRelative contributions of polarizability and free volume in reduction of refractive index and dielectric constant with fluorine substitution in polyimides by positron annihilation spectroscopy
- Gareth G. Hougham
- Y.C. Jean
- 2013
- Macromolecular Chemistry and Physics
PaperNext-generation nanotechnology laboratories with simultaneous reduction of all relevant disturbances
- Emanuel Lörtscher
- Daniel Widmer
- et al.
- 2013
- Nanoscale
PaperLiquid coating processes for nanoparticle films with defined microstructure
- Tobias Kraus
- 2013
- AIChE 2013
Conference paperDot-matrix marks for dynamic overlay measurements in electron beam lithography
- Ernst Kratschmer
- James J. Bucchignano
- et al.
- 2013
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
PaperInjectable hydrogels from triblock copolymers of vitamin E-functionalized polycarbonate and poly(ethylene glycol) for subcutaneous delivery of antibodies for cancer therapy
- Ashlynn L. Z. Lee
- Victor W. L. Ng
- et al.
- 2013
- Advanced Functional Materials
PaperEffects of sodium citrate concentration on electroless Ni-Fe bath stability and deposition
- Myung-Won Jung
- Sung K. Kang
- et al.
- 2013
- Journal of Electronic Materials
PaperComputational modeling of hot-spot identification and control in 3-D stacked chips with integrated cooling
- Fabio Alfieri
- Sacha Gianini
- et al.
- 2013
- Numerical Heat Transfer; Part A: Applications
PaperEnergy-efficient cooling of liquid-cooled electronics having temperature-dependent leakage
- Shawn A. Hall
- Gerard V. Kopcsay
- 2013
- Journal of Thermal Science and Engineering Applications
Paper