1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- Hussein Hamieh
- Juliano Borges
- et al.
- 2023
- ECTC 2023
Conference paper
Publications
24855 results for Exploratory Science
Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- Shrivani Pandiya
- Serge Ecoffey
- et al.
- 2023
- ECTC 2023
Conference paperDevelopment of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- Juliano Borges
- Maxime Darnon
- et al.
- 2023
- ECTC 2023
Conference paperA new era of collaborative experimentation enabled by multi-cloud and AI foundation models
- Patrick Ruch
- Alain Vaucher
- et al.
- 2023
- Future Labs Live 2023
Conference paperSolder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
- Hafiz Wakas Ali
- David Danovitch
- et al.
- 2023
- ECTC 2023
Conference paperEPA Compositions on Realtime Streaming Analytics
- Henrique Villaça
- Sean Siqueira
- et al.
- 2023
- SBSI 2023
Conference paperExploring In-Context Learning Capabilities of Foundation Models for Generating Knowledge Graphs from Text
- Hanieh Khorashadizadeh
- Nandana Mihindukulasooriya
- et al.
- 2023
- TEXT2KG 2023
Conference paperUnderstanding Customer Requirements - An Enterprise Knowledge Graph Approach
- 2023
- ESWC 2023
Conference paperAn Improved Questionnaire for FAIR Characterization
- Leonardo Guerreiro Azevedo
- Julio Cesar Cardoso Tesolin
- et al.
- 2023
- ESWC 2023
Workshop paperHierarchical Clifford Transformations to Reduce Entanglement in Quantum Chemistry Wave Functions
- Ryan V. Mishmash
- Tanvi P. Gujarati
- et al.
- 2023
- JCTC
Paper