Electrical test sites for AMLCD-TFT array process characterization
- E.G. Colgan
- R.J. Polastre
- et al.
- 1998
- MRS Spring Meeting 1998
Conference paper
Publications
3555 results for Materials Discovery
Reliability and copper interconnections with low dielectric constant materials
- C.-K. Hu
- 1998
- MRS Spring Meeting 1998
Conference paperTemplating nanopores into poly(methylsilsesquioxane): new low-dielectric coatings suitable for microelectronic applications
- J. Remenar
- C.J. Hawker
- et al.
- 1998
- MRS Spring Meeting 1998
Conference paperCopper ULSI interconnect technology
- D. Edelstein
- 1998
- MRS Spring 1998
Conference paperPrinting patterns of proteins
- A. Bernard
- E. Delamarche
- et al.
- 1998
- Langmuir
PaperCharacterization of plated Cu thin film microstructures
- L. Gignac
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperMechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperThe structure of formate on TiO2(110) by scanned-energy and scanned-angle photoelectron diffraction
- S. Thevuthasan
- G.S. Herman
- et al.
- 1998
- Surface Science
PaperX-ray diffraction study of mechanochemical synthesis and formation mechanisms of zirconium carbide and zirconium silicides
- Bing K. Yen
- 1998
- Journal of Alloys and Compounds
PaperMechanical testing of thin polymer films
- Claudiu Feger
- 1998
- APM 1998
Conference paper