Thermo-mechanical evaluation of 3D packages
- Sayuri Kohara
- Akihiro Horibe
- et al.
- 2013
- 3DIC 2013
Publications
9292 results for Computer Science
Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs
- Xin Zhao
- Yang Wan
- et al.
- 2013
- ICCAD 2013
Optimal distributed power generation for thermal and electrical scheduling in a microgrid
- Mingming Liu
- Emanuele Crisostomi
- et al.
- 2013
- ISGT-Europe 2013
A novel finite element method assembler for co-processors and accelerators
- Nina Hanzlikova
- Eduardo Rocha Rodrigues
- 2013
- SC 2013
Depth controlled symmetric function fanin tree restructure
- Hua Xiang
- Lakshmi Reddy
- et al.
- 2013
- ICCAD 2013
Nanosensors for next generation drug screening
- Sridhar K. Kannam
- Matthew T. Downton
- et al.
- 2013
- SPIE Micro+Nano Materials, Devices, and Applications 2013
Optimization algorithms for energy-efficient data centers
- Hendrik F. Hamann
- 2013
- InterPACK 2013
Optimal utilization of power transformers through virtual sensing
- Jagabondhu Hazra
- Kaushik Das
- et al.
- 2013
- ISGT-Europe 2013
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack
- Keiji Matsumoto
- Soichiro Ibaraki
- et al.
- 2013
- 3DIC 2013
A statistical approach to real-time updating and automatic scheduling of physical models
- Huijing Jiang
- Xinwei Deng
- et al.
- 2013
- InterPACK 2013