Diffusion in several materials relevant to Cu interconnection technology
- D. Gupta
- 1995
- Materials Chemistry & Physics
Paper
Publications
26909 results for Science
Nematic homogeneous photo alignment by polyimide exposure to linearly polarized uv
- Masaki Hasegawa
- Yoichi Taira
- 1995
- J. Photopolym. Sci. Tech.
PaperUse of high temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface modified by an ac nitrogen glow discharge
- J.B. Ma
- J. Dragon
- et al.
- 1995
- Journal of Adhesion Science and Technology
PaperSiGe/Si quantum wells with abrupt interfaces grown by atmospheric pressure chemical vapor deposition
- DA Grützmacher
- TO Sedgwick
- et al.
- 1995
- Vacuum
PaperOn the numerical treatment of singularities in solutions of laplace’s equation
- W. Liniger
- F. Odeh
- 1995
- Numerical Functional Analysis and Optimization
PaperThickness dependent dielectric properties of sol-gel prepared lead lanthanum titanate films
- D.B. Beach
- R.B. Laibowitz
- et al.
- 1995
- Integrated Ferroelectrics
PaperElectro-optic measurements of poled polymeric films
- J.D. Swalen
- J.I. Thackara
- 1995
- Molecular Crystals and Liquid Crystals Science and Technology Section B: Nonlinear Optics
PaperMolecular Docking Studies in Organic Photoconductors: The Chlorodiane Blue and p-(Diethylamino)benzaldehyde Diphenylhydrazone Interface
- J. Pacansky
- R.J. Waltman
- et al.
- 1995
- Chemistry of Materials
PaperAtomic hydrogen-induced degradation of the Si SiO2 structure
- E. Cartier
- J.H. Stathis
- 1995
- Microelectronic Engineering
PaperFQHE states of high mobility n-Si/Si1-xGex heterostructures in pulsed magnetic fields
- R.B. Dunford
- R. Newbury
- et al.
- 1995
- Solid State Communications
Paper