Thermal stress analysis of pin grid array structures: Module and card interactions
- P.A. Engel
- J.R. Webb
- 1992
- ASME Journal of Electronic Packaging
Paper
Publications
24879 results for Exploratory Science
Kinetics of true mean-field Ising models and the Langevin equation: A comparison
- Karl F. Ludwig Jr.
- Byungwoo Park
- 1992
- Physical Review B
PaperMoment relationships for queues with Poisson input
- Ilias Iliadis
- S.W. Fuhrmann
- 1992
- Queueing Systems
PaperThermal structural disorder and melting at a crystalline interface
- Tue Nguyen
- Paul S. Ho
- et al.
- 1992
- Physical Review B
PaperGrain-size effects in the indentation fracture of MgO
- R.F. Cook
- E. Liniger
- 1992
- Journal of Materials Science
PaperOn optimal lateness and tardiness scheduling in real-time systems
- Alexander D. Stoyenko
- L. Georgiadis
- 1992
- Computing
PaperPoint-contact spectroscopy of superconducting URu2Si2
- K. Hasselbach
- J.R. Kirtley
- et al.
- 1992
- Physical Review B
PaperMagneto-optical and magnetic study of amorphous U-As, U-As-Cu, and U-As-Ti films
- P. Fumagalli
- T.S. Plaskett
- et al.
- 1992
- Physical Review B
PaperBanded matrices with banded inverses
- Charles A. Micchelli
- 1992
- J. Comput. Appl. Math.
PaperInvestigations on the quality of polysilicon film-gate dielectric interface in polysilicon thin film transistors
- Ji-Ho Kung
- Miltiadis K. Hatalis
- et al.
- 1992
- Thin Solid Films
Paper