Opportunities of Si ULSI Technology for GHz Applications
- Jack Y. C. Sun
- 1995
- UEO 1995
Conference paper
Publications
3555 results for Materials Discovery
A global sensitivity approach for the dynamic response of printed wiring boards
- H. Jensen
- A.O. Cifuentes
- 1995
- ASME Journal of Electronic Packaging
PaperThe structure, bonding and chemistry of grain boundaries in Ni3Al
- S. Subramanian
- D.A. Muller
- et al.
- 1995
- Materials Science and Engineering A
PaperKinetic studies of intermetallic compound formation by resistance measurements
- S.-L. Zhang
- F.M. d'Heurle
- 1995
- Thin Solid Films
PaperPeriodically Poled KTiOPO4: A "New" Nonlinear Material for Bulk Xnteractions
- Qibiao Chen
- W.P. Risk
- et al.
- 1995
- ASSL 1995
Conference paperSpin-polarized electron tunneling: The importance of the potential barrier shape
- S.F. Alvarado
- 1995
- Materials Science and Engineering B
PaperAdhesion properties of a structural etch stop material for use in multilayer electronic wiring structures
- R.A. Haring
- Sharon L. Nunes
- et al.
- 1995
- Journal of Materials Research
PaperUsing scanning tunneling microscopy to underst and diffraction oscillations: Fe growth on Cu(100)
- Kevin E. Johnson
- 1995
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
PaperIn-situ X-ray studies of organometallic vapor phase epitaxy growth
- P.H. Fuoss
- D.W. Kisker
- et al.
- 1995
- Materials Science and Engineering B
PaperSurface and interface analysis at 3rd generation light sources
- F.J. Himpsel
- H. Akatsu
- et al.
- 1995
- Progress in Surface Science
Paper