Interface reactions with formation of a solid phase on a solid substrate: a short overview
- F.M. d'Heurle
- 1993
- MSF
Paper
Publications
26903 results for Science
Performance consideration for the scaling of sub-micron on-chip interconnections
- Yuh-Jier Mii
- 1992
- SPIE Microelectronic Processing 1992
Conference paperElectromigration and current-carrying implications for aluminum-based metallurgy with tungsten stud-via interconnections
- H.S. Rathore
- R. Filippi
- et al.
- 1992
- SPIE Microelectronic Processing 1992
Conference paperElectromigration and stress reliability in multilevel interconnect metallization
- Paul S. Ho
- M.A. Moske
- et al.
- 1992
- SPIE Microelectronic Processing 1992
Conference paperEffect of strain on diffusion kinetics and activation energy for al grain-boundary diffusion: A computer simulation
- Thomas Kwok
- 1992
- SPIE Microelectronic Processing 1992
Conference paperEffects of texture, microstructure, and alloy content on electromigration of aluminum-based metallization
- D.B. Knorr
- K.P. Rodbell
- 1992
- SPIE Microelectronic Processing 1992
Conference paperThe adsorption structure of 2,5-dihydrothiophene on Mo(110)-(4 × 1)-S: ring orientation as determined by NEXAFS
- Han Xu
- Per Uvdal
- et al.
- 1993
- Surface Science
PaperA simple linear-time algorithm for the recognition of bandwidth-2 biconnected graphs
- Fillia Makedon
- Dafna Sheinwald
- et al.
- 1993
- Information Processing Letters
PaperMultilayer high-temperature superconductors
- N. Lazarides
- T. Schneider
- et al.
- 1993
- Physica C: Superconductivity and its applications
PaperDielectric response in p-type silicon: Screening and band-gap narrowing
- L.R. Logan
- J.L. Egley
- 1993
- Physical Review B
Paper