Characterization of stacked die using die-to-wafer integration for high yield and throughput
- K. Sakuma
- P. Andry
- et al.
- 2008
- ECTC 2008
Conference paper
Publications
18 results at ECTC 2008
The viability of 25 Gb/s on-board signalling
- Mark B. Ritter
- Petar Pepeljugoski
- et al.
- 2008
- ECTC 2008
Conference paperComparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
Conference paperC4NP Cu-cored Pb-free flip chip interconnections
- Jae-Woong Nah
- Stephen L. Buchwalter
- et al.
- 2008
- ECTC 2008
Conference paper3D silicon integration
- J. Knickerbocker
- P. Andry
- et al.
- 2008
- ECTC 2008
Conference paperUnderfill fracture toughness as a function of cooling rate
- Soojae Park
- Claudius Feger
- 2008
- ECTC 2008
Conference paperHigh-density optical interconnect exploiting build-up waveguide-on-SLC board
- Shigeru Nakagawa
- Yoichi Taira
- et al.
- 2008
- ECTC 2008
Conference paperChip package interaction evaluation for a high performance 65nm and 45nm CMOS technology in a stacked die package with C4 and wirebond interconnections
- Christopher Muzzy
- David Danovitch
- et al.
- 2008
- ECTC 2008
Conference paper