Embedded power insert enabling dual-side cooling of microprocessors
- Thomas Brunschwiler
- Dominic Gschwend
- et al.
- 2015
- ECTC 2015
Conference paper
Publications
18 results at ECTC 2015
Electromigration and thermal migration in Pb-free interconnects
- Minhua Lu
- Thomas Wassick
- et al.
- 2015
- ECTC 2015
Conference paperThrough silicon via process for effective multi-wafer integration
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2015
- ECTC 2015
Conference paperSilicon photonics packaging for highly scalable optical interconnects
- Antonio La Porta
- Jonas Weiss
- et al.
- 2015
- ECTC 2015
Conference paperInfluence of UBM metallurgy on Sn textures and em failure
- Minhua Lu
- Hongqing Zhang
- 2015
- ECTC 2015
Conference paperAn enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
- Katsuyuki Sakuma
- Krishna Tunga
- et al.
- 2015
- ECTC 2015
Conference paperOrganic Multi-Chip Module for high performance systems
- Lei Shan
- Young Kwark
- et al.
- 2015
- ECTC 2015
Conference paperPlanarity-tolerant fine-pitch reworkable interconnections with sharp protrusions and microbumps
- Y. Liu
- Steven L. Wright
- et al.
- 2015
- ECTC 2015
Conference paper