High-speed signaling performance of multilevel wiring on glass substrates for 2.5-D integrated circuit and optoelectronic integration
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2013
- ECTC 2013
Conference paper
Publications
13 results at ECTC 2013
Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates
- Katsuyuki Sakuma
- Edmund Blackshear
- et al.
- 2013
- ECTC 2013
Conference paperThermally enhanced pre-applied underfills for 3D integration
- Akihiro Horibe
- Keishi Okamoto
- et al.
- 2013
- ECTC 2013
Conference paper