Publications

12 results at ECTC 2010

IMC bonding for 3D interconnection
- - Katsuyuki Sakuma
  - Kuniaki Sueoka
  - et al.
- 2010
- ECTC 2010
Conference paper
Underfill acceleration factor based on thermal fatigue crack growth rate
- - Soojae Park
  - Claudius Feger
  - et al.
- 2010
- ECTC 2010
Conference paper