Device, circuit and system-level analysis of noise in multi-bit phase-change memoryGael F. CloseUrs Freyet al.2010IEDM 2010
High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibilityTakeshi NogamiTibor Bolomet al.2010IEDM 2010
Reliability and structural design of a wafer-level 3D integration scheme with W TSVs based on Cu-oxide hybrid wafer bondingK.N. ChenT.M. Shawet al.2010IEDM 2010
Wafer scale fabrication of carbon nanotube FETs with embedded poly-gatesShu-Jen HanJosephine Changet al.2010IEDM 2010