Fully scaled 0.5 μm MOS cicuits by synchroton X-ray lithography: Resist systems and line width control
- David Seeger
- K.T. Kwietniak
- et al.
- 1989
- Microelectronic Engineering
Paper
Publications
221 results at Microelectronic Engineering
A comparison of the E-beam sensitivities and relative O2-plasma stabilities of organosilicon polymers.Part III. Lithographic characteristics of poly-1,1,3-trimethyl-1-sila - and poly-1,1,3,3-tetramethyl-1,3- disilacyclobutenes and related silmethylene polymers
- E. Babich
- J. Paraszczak
- et al.
- 1989
- Microelectronic Engineering
PaperFully scaled 0.5 μm MOS circuits by synchrotron radiation X-ray lithography: Devices fabrication and overlay evaluation
- J. Silverman
- V. Dimilia
- et al.
- 1989
- Microelectronic Engineering
PaperChemically assisted ion beam etching process for high quality laser mirrors
- P. Buchmann
- H.P. Dietrich
- et al.
- 1989
- Microelectronic Engineering
PaperA Single Expose Double Develop (SEDD) process for self-aligned lithographic applications
- Donis Flagello
- Andrew Pomerene
- 1989
- Microelectronic Engineering
PaperX-ray transmission through low atomic number particles
- R.A. DellaGuardia
- David Seeger
- et al.
- 1989
- Microelectronic Engineering
PaperElectrical resistivity and radiation damage in boro-hydro-nitride x-ray lithography mask substrates
- S.S. Dana
- J. Batey
- et al.
- 1987
- Microelectronic Engineering
PaperPhotoemission sampling technique for high-speed integrated-circuit testing
- H. Beha
- H.K. Seitz
- et al.
- 1987
- Microelectronic Engineering
PaperThe use of organosilicon polymers in multilayer plasma resist processing
- J. Paraszczak
- E. Babich
- et al.
- 1987
- Microelectronic Engineering
PaperResist image enhancement by UV-, soft vacuum pulsed electron beams and organometallic compounds
- Hiroyuki Hiraoka
- 1987
- Microelectronic Engineering
Paper