Comparison of finite element stress analysis results with peel strength at the copper-polyimide interface
- R.H. Lacombe
- L.P. Buchwalter
- et al.
- 1993
- Journal of Adhesion Science and Technology
Paper
Publications
3553 results for Materials Discovery
An Ion Transfer Model for Contact Charging
- A. Diaz
- D. Fenzel-Alexander
- 1993
- Langmuir
PaperEffects of substrate bias frequency in an electron cyclotron resonance plasma reactor
- W.M. Holber
- 1993
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
PaperStress development and relaxation in copper films during thermal cycling
- M.D. Thouless
- J. Gupta
- et al.
- 1993
- Journal of Materials Research
PaperCopper deposition by electron cyclotron resonance plasma
- A. Sugerrnan
- F.E. Turene
- et al.
- 1993
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
PaperTantalum and chromium adhesion to polyimide. Part 1. BPDA-PDA surface imidization and modification
- L.P. Buchwalter
- Ravi F. Saraf
- 1993
- Journal of Adhesion Science and Technology
PaperKinetic model for the chemical vapor deposition of tungsten in the silane reduction process
- Julian J. Hsieh
- 1993
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
PaperAbrasive wear and craze breakdown in polystyrene
- A.C.M. Yang
- T.W. Wu
- 1993
- Journal of Materials Science
PaperCharacterization of fullerenes and doped fullerenes
- C.S. Yannoni
- H.R. Wendt
- et al.
- 1993
- Synthetic Metals
PaperCharacterization of YBa2Cu3Ox using core- and valence-level XPS
- C.R. Brundle
- D.E. Fowler
- 1993
- Surface Science Reports
Paper