Voids-free Die-level Cu/ILD Hybrid bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2023
- ECTC 2023
Conference paper
Publications
283 results for AI Hardware
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- Aakrati Jain
- Risa Miyazawa
- et al.
- 2023
- ECTC 2023
Conference paperInnovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- Griselda Bonilla
- 2023
- iTHERM 2023
KeynoteAcceleration of Decision-Tree Ensemble Models on the IBM Telum Processor
- Nikolaos Papandreou
- Jan Van Lunteren
- et al.
- 2023
- ISCAS 2023
Conference paperArchitectures and Circuits for Analog-memory-based Hardware Accelerators for Deep Neural Networks
- Sidney Tsai
- Pritish Narayanan
- et al.
- 2023
- ISCAS 2023
Invited talkPhysical modeling and design rules of analog Conductive Metal Oxide-HfO2 ReRAM
- Donato Francesco Falcone
- Stephan Menzel
- et al.
- 2023
- IMW 2023
Workshop paperStochastic magnetic tunnel junction with easy-plane dominant anisotropy
- Jonathan Z. Sun
- Christopher Safranski
- et al.
- 2023
- Physical Review B
PaperArtificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- Sathya Raghavan
- Hiroyuki Mori
- et al.
- 2023
- ECTC 2023
PosterMulti-objective Hardware-Aware Neural Architecture Search with Pareto Rank-preserving Surrogate Models
- Hadjer Benmeziane
- Hamza Ouarnoughi
- et al.
- 2023
- ACM TACO
PaperOptimization of Projected Phase Change Memory for Analog In-Memory Computing Inference
- Ning Li
- Charles Mackin
- et al.
- 2023
- Advanced Materials
Paper