Publications

298 results for AI Hardware

Contact Cavity Shaping and Selective SiGe:B Low-Temperature Epitaxy Process Solution for sub 10^-9 Ω.cm² Contact Resistivity in Nonplanar FETs
- - N. Breil
  - B.-C. Lee
  - et al.
- 2023
- VLSI Technology 2023
Conference paper
Benchmarking novel AI accelerators: striving to be both fair and comprehensive
- - Geoffrey Burr
- 2023
- VLSI Technology 2023
Workshop paper
In-memory computing for accelerating deep neural networks and neuro-vector-symbolic architectures
- - Manuel Le Gallo
  - Irem Boybat-Kara
  - et al.
- 2023
- AICAS 2023
Tutorial
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- - Duixian Liu
  - Xiaoxiong Gu
  - et al.
- 2023
- ECTC 2023
Conference paper
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- - Juliano Borges
  - Maxime Darnon
  - et al.
- 2023
- ECTC 2023
Conference paper
On the path to AI hardware via chiplet integration enabled by high density organic substrates
- - Griselda Bonilla
  - Brian Quinlan
  - et al.
- 2023
- ECTC 2023
Conference paper
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- - Aakrati Jain
  - Risa Miyazawa
  - et al.
- 2023
- ECTC 2023
Conference paper
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- - Prabudhya Roy Chowdhury
  - Sathya Raghavan
  - et al.
- 2023
- ECTC 2023
Conference paper
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- - Toyohiro Aoki
  - Katsuyuki Sakuma
  - et al.
- 2023
- ECTC 2023
Conference paper
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- - Katsuyuki Sakuma
  - Griselda Bonilla
  - et al.
- 2023
- ECTC 2023
Conference paper