Copper microstructure: Effect on electromigration void evolution
- C. Witt
- V. Calero
- et al.
- 2010
- ADMETA 2010
Conference paper
Publications
14466 results for Physical Sciences
Evolution of stress gradients in Cu thin films induced by capping layers
- 2010
- ADMETA 2010
Conference paperComparative study of CVD TiN vs. ALD TiN for contact metallization in 32nm node and beyond
- Valli Arunachalam
- Filippos Papadatos
- et al.
- 2010
- ADMETA 2010
Conference paperSimultaneous measurement of optical properties and geometry of resist using multiple scatterometry gratings
- Alok Vaid
- Matthew Sendelbach
- et al.
- 2010
- SPIE Advanced Lithography 2010
Conference paperThe impact of hole-induced electromigration on the cycling endurance of phase change memory
- M. H. Lee
- R. Cheek
- et al.
- 2010
- IEDM 2010
Conference paperMetallization opportunities and challenges for future back-end-of-the-line technology
- Cyril Cabral Jr.
- Benjamin Fletcher
- et al.
- 2010
- ADMETA 2010
Conference paperFuture of PECVD and spin-on low-k materials
- Geraud Dubois
- 2010
- ADMETA 2010
Conference paperHigh on-off ratio bilayer graphene complementary field effect transistors
- Kausik Majumdar
- Kota V. R. M. Murali
- et al.
- 2010
- IEDM 2010
Conference paperSpatial signature in local overlay measurements - "what CD-SEM can tell us and optical measurements can not"
- Scott Halle
- Daniel Moore
- et al.
- 2010
- SPIE Advanced Lithography 2010
Conference paperRF performance of short channel graphene field-effect transistor
- Yanqing Wu
- Yu-Ming Lin
- et al.
- 2010
- IEDM 2010
Conference paper