Effective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)
- F. Ito
- H. Shobha
- et al.
- 2010
- ADMETA 2010
Conference paper
Publications
14466 results for Physical Sciences
Co capping layers for Cu/low-k interconnects
- C.-C. Yang
- P. Flaitz
- et al.
- 2010
- ADMETA 2010
Conference paperGraphene-based fast electronics and optoelectronics
- Ph. Avouris
- Yu-Ming Lin
- et al.
- 2010
- IEDM 2010
Conference paperHybrid reference metrology exploiting patterning simulation
- Narender Rana
- Chas Archie
- 2010
- SPIE Advanced Lithography 2010
Conference paperHysteretic drain-current behavior due to random telegraph noise in scaled-down FETs with high-κ/metal-gate stacks
- Hiroshi Miki
- Naoki Tega
- et al.
- 2010
- IEDM 2010
Conference paper3D-AFM enhancement for CD metrology dedicated to lithography sub-28-nm node requirements
- Johann Foucher
- Narender Rana
- et al.
- 2010
- SPIE Advanced Lithography 2010
Conference paperSimultaneous measurement of optical properties and geometry of resist using multiple scatterometry gratings
- Alok Vaid
- Matthew Sendelbach
- et al.
- 2010
- SPIE Advanced Lithography 2010
Conference paperNonvolatile polymer memory with nanoconfinement of ferroelectric crystals
- Seok Ju Kang
- Insung Bae
- et al.
- 2010
- Nano Letters
PaperAdvanced metallization developments for 32-nm node CMOS technology contact architecture
- Doug H. Lee
- Valli Arunachalam
- et al.
- 2009
- ADMETA 2009
Conference paperCoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- E. Huang
- M. Oh
- et al.
- 2009
- ADMETA 2009
Conference paper