Fundamental Study of Acid Copper Through-Hole Electroplating Process
- Edward K. Yung
- Lubomyr T. Romankiw
- 2019
- JES
Paper
Publications
24897 results for Exploratory Science
Repassivation transients measured with thin film breaking electrodes
- G.S. Frankel
- B. Rush
- et al.
- 2019
- JES
PaperShort Time Annealing of Coevaporated Tungsten Silicide Films
- T.O. Sedgwick
- F.M. d'Heurle
- et al.
- 2019
- JES
PaperComputer Simulation of Oxygen Segregation in CZ/MCZ Silicon Crystals and Comparison with Experimental Results
- W.E. Langlois
- 2019
- JES
PaperProduction and Characterization of Extremely Corrosion Resistant Chromium-Metalloid Alloys
- R.M. Latanision
- R.R. Ruf
- 2019
- JES
PaperChemical Vapor Deposition of Epitaxial Silicon from Silane at Low Temperatures: I. Very Low Pressure Deposition
- James H. Comfort
- Rafael Reif
- 2019
- JES
PaperReactive Ion Etching of PECVD Amorphous Silicon and Silicon Nitride Thin Films with Fluorocarbon Gases
- Yue Kuo
- 2019
- JES
PaperThe Analysis of Diffusion Data by a Method of Moments
- R. Ghez
- J.D. Fehribach
- et al.
- 2019
- JES
PaperA Diffusion Model for Electron-Hole Recombination in Zn2SiO4:(Mn, As) Phosphors
- D.J. Robbins
- N. Caswell
- et al.
- 2019
- JES
PaperReactive Ion Etching in SF6 Gas Mixtures
- R. Pinto
- R.S. Babu
- 2019
- JES
Paper